What we do
We are a Hong Kong company and a manufacturing partner, not a design house. You bring a design that is finished, or silicon that already exists, and we run it through the chain in mainland China to a packaged, tested part.
Wafer supply and foundry access
Foundry placement
We match your design to a foundry by process node, wafer size and the volume you actually need, then hold the account. Where the volume is small, that placement is the whole value: it is the step a first-time customer cannot take alone.
Multi-project wafer shuttles
For first silicon, a shuttle puts your design on a shared reticle and shares the mask cost across everyone on it. Slower than a dedicated run and far cheaper, and the right answer for a first pass.
Working from your wafers
If you already hold wafers or known-good die, we start at incoming inspection and take it from there. We will ask to see the provenance before the material moves.
Assembly and packaging
Front of line
Incoming wafer inspection, wafer probe with a card built to your test limits, backgrinding to the target thickness, and dicing. Map data comes back to you with the lot.
Die attach and interconnect
Epoxy or film die attach onto a leadframe or substrate, then gold, copper or aluminium wire bonding — or flip chip where the pad pitch and the thermal path call for it.
Encapsulation and finishing
Transfer moulding, post-mould cure, laser marking to your artwork, deflash, plating, singulation and tape-and-reel. Marking is applied only to die you own or are licensed to sell.
Test
Wafer sort
DC screening and functional sort at temperature where the product needs it, with yield data and a wafer map per lot.
Final test
Commercial ATE with load boards and programs written to your limits. DC, RF and mixed-signal, including conversion gain, IIP3, noise figure, INL and DNL, SNR and SFDR.
Where the standard cell is not enough
High-resolution converters and low phase-noise clock parts outrun a tester's built-in generator. Those need a hybrid cell with an external source and filtering. We say so at quotation, with the cost attached, rather than discovering it during the build.
Qualification and supply
Reliability
HTOL 1000 h, temperature humidity bias, temperature cycling, moisture sensitivity level and ESD and latch-up, to commercial grade by default and to automotive grade where you need it.
Documentation
Qualification report, per-lot test summary, date and lot coding, and a traceability record that survives an audit by your own customer.
Repeat supply
Once a build is qualified, the value of the relationship is that it is boring: same line, same program, same package, on a delivery schedule you can plan around.
What we do not do
- We do not design your chip. Front-end design, verification and layout are yours or your design house's. We start where a design is finished.
- We do not put your marking on someone else's die. Packaging a third party's die under your own brand is counterfeiting. Large assembly houses reject it at intake, and so do we. Your own die, licensed die, or a white-label agreement with the owner — those are the routes that exist.
- We do not take an order without knowing where it goes. See the compliance page. This one is not negotiable and it is not personal.